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• Business: Electronics and Electrical: Contract Manufacturing  (873)

• ACI Group - Offers turnkey contract manufacturing, logistics and testing services.
• Advanced Thin Film Technology - Provides high quality thin film coatings, patterned substrates, hybrid and resistor networks.
• AME AS - Custom and standard silicon photodetectors and thick and thin film optoelectronic devices, offering wafer fabrication, bonding and packaging, and testing.
• Amitec - Provides high density interconnect (HDI) substrates and flip chip semiconductor BGA packaging for single or multichip (MCM) modules. Packaging description, technical notes, and company presentations.
• ASE Korea, Inc. - Assembly and testing services for sensor, wireless, and automotive semiconductors. Facilities in Asia, Europe, and USA. Site lists capabilities including test equipment used, and package datasheets are available in PDF.
• Catalyst Microtech LLC - Semiconductor assembly and packaging services, including quick turn and turn key projects for mil-std, BGA, folded flex, and multichip packages. List of services and factory equipment and quotation form.
• Chartered Semiconductor Manufacturing - Dedicated integrated circuit (IC) wafer foundry
• Cirtek Electronics Corporation - An independent subcontractor for semiconductor assembly, test and packaging services.
• DALSA Semiconductor - Open foundry offering specialty wafer fabrication for MEMS, high voltage CMOS, analog and mixed signal CMOS, and CCDs with experience in telecom, telephony, and optical networking chips. Company overview, facilities and manufacturing process descriptions.
• Dolphin Technology Inc. - Provides a wide range of high performance, high speed silicon-IP. For designers, needing standard or custom IP such as memory, I/O, standard cell libraries, data path modules or analog blocks.
• Eltek Semiconductors Ltd - Procuring and processing semiconductor components in wafer, die and packaged form.
• First Level Inc. - Manufacturing service specializing in microelectronic packaging needs. Offering contract assembly in ESD protected clean rooms, COB, die attach, wirebonding, component pick and place, MCM, BGA, CSP, and flip chip.
• Honeywell Electronic Materials - Offers interconnect solutions and IC packaging specializing in on-chip semiconductor interconnects, including spin-on dielectrics and sputtering targets. Product and technology briefs, and a description of company's manufacturing cleanroom.
• Incide - A fabless design house focused on RF and high-speed digital integrated designs.
• Jade Precision Engineering Pte Ltd - Singapore-based company providing lead-frame stamping, milling, plating, and taping services for semiconductors. Company history, description of services, and photos of example products.
• NOVASIC - Providing wafering and polishing services of high performance semiconductors and industrial crystals.
• PolarFab - Bipolar and BiCMOS wafer manufacturing processes. Bloomington, MN, USA.
• Prema Semiconductor - Fabricates analog and mixed-signal ICs
• Premier Semiconductor Services - Back-end services for commercial, aerospace, and military products including semiconductor taping, BGA balling, and baking.
• Prologue Technology Inc. - Manufacturer representative for semiconductor design and manufacturing. Based in Markham, Ontario, Canada, serving primarily Canada, Central and Eastern US. Close proximity to the Lester B. Pearson Airport in Toronto.
• Promex Industries Inc. - Microelectronics technologies, specialty chip packaging, design, layout, materials expertise, process engineering for outsourced optoelectronics, microelectronics, chip packaging and manufacturing. From China.
• Protochips Inc. - Offers custom layout and fabrication services for emerging companies and university groups.
• Reltech Limited - European supplier of advanced semiconductor burn-in and reliability test systems.
• Satcon Electronics - Manufacturer standard and custom microelectronic assemblies, thin film substrates, semiconductor packaging and wire bonding. Company overview and list of capabilities.
• Sigurd Microelectronics Corporation - Provides semiconductor IC assembly and testing services.
• Silicon Infusion Limited - Provides single chip solutions for T1/E1/J1, DTMF, ADPCM, and many other telecommunications standards.
• Silterra Malaysia Sdn Bhd - Manufacturer of semiconductors and wafers. Headquarters in Kulim, Kedah, Malaysia.
• 1st Silicon - Semiconductor foundry founded in 1998 by the Malaysian State of Sarawak. 0.18 and 0.25 micron CMOS and mixed signal CMOS IC.
• Tower Semiconductor LTD. - Independent foundry of semiconductor integrated circuits specializing in embedded nonvolatile memory, CMOS image sensors, and mixed signal devices. 0.35 micron and up. Israel.
• Trikon Technologies - Semiconductor manufacturer utilizing plasma etch, PVD (physical vapour deposition) and CVD (chemical vapour deposition) equipment.
• Valtronic - Manufacturers custom miniature modules and packaging, including chip-on-board, flip chip, chip-on-chip, and multichip modules. Site include capabilites, and illustrated discussions of packaging technologies and processes.
• ViASIC - Company offering low NRE one mask architecture and software solutions to the ASIC community. Aimed at FPGA conversion and ASIC replacement markets.
• WaferTech - Wafer manufacturing, probing, assembly and final test. .25 micron. Fab in Washington State, USA.